Invention Grant
- Patent Title: Power core devices
- Patent Title (中): 电源核心器件
-
Application No.: US11289994Application Date: 2005-11-30
-
Publication No.: US07613007B2Publication Date: 2009-11-03
- Inventor: Daniel Irwin Amey, Jr. , Sounak Banerji , William J. Borland , Karl Hartmann Dietz , David Ross McGregor , Attiganal N. Sreeram
- Applicant: Daniel Irwin Amey, Jr. , Sounak Banerji , William J. Borland , Karl Hartmann Dietz , David Ross McGregor , Attiganal N. Sreeram
- Applicant Address: US DE Wilmington
- Assignee: E. I. du Pont de Nemours and Company
- Current Assignee: E. I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H05K1/18
- IPC: H05K1/18
Abstract:
The present invention relates to a device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor; and at least one planar capacitor laminate; wherein said planar capacitor laminate serves as a low inductance path to supply a charge to said at least one embedded singulated capacitor; and wherein said at least one embedded singulated capacitor is connected in parallel to at least one of the said planar capacitor laminates; and wherein said power core is interconnected to at least one signal layer.
Public/Granted literature
- US20060138591A1 Power core devices and methods of making thereof Public/Granted day:2006-06-29
Information query
