发明授权
US07613368B2 Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types
有权
混合电和光LGA插入器，用于通过双信号类型促进芯片到板通信
- 专利标题： Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types
- 专利标题（中）： 混合电和光LGA插入器，用于通过双信号类型促进芯片到板通信
-
申请号： US10988220申请日： 2004-11-12
-
公开(公告)号： US07613368B2公开(公告)日： 2009-11-03
- 发明人: Gareth G. Hougham , Russell A. Budd , Punit P. Chiniwalla , Paul W. Coteus , Alphonso P. Lanzetta , Frank R. Libsch
- 申请人： Gareth G. Hougham , Russell A. Budd , Punit P. Chiniwalla , Paul W. Coteus , Alphonso P. Lanzetta , Frank R. Libsch
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Daniel P. Morris; Anne Vachon Dougherty
- 主分类号： G02B6/12
- IPC分类号： G02B6/12
摘要：
Integrated optoelectronic chips or collections of chips on a module that have both electrical as well as optical interconnects offer many advantages in speed, power consumption and heat generation. Mixed signal types, however, pose significant packaging challenges. This invention describes a land grid array (LGA) interposer which can simultaneously connect electrical and optical signals from a module to a printed circuit board.
公开/授权文献
信息查询
