Invention Grant
- Patent Title: Bus structure
- Patent Title (中): 总线结构
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Application No.: US11136558Application Date: 2005-05-25
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Publication No.: US07619166B2Publication Date: 2009-11-17
- Inventor: Kuo-Ching Huang , Yu-Cheng Chang
- Applicant: Kuo-Ching Huang , Yu-Cheng Chang
- Agency: Workman Nydegger
- Priority: TW93127020A 20040907
- Main IPC: H01B7/08
- IPC: H01B7/08
Abstract:
A bus structure may include two or more soft buses and one or more soft separation layers. The two or more soft buses may be stacked side by side with respect to each other. The one or more soft separation layers may be sandwiched between two adjacent soft buses of the two or more soft buses.
Public/Granted literature
- US20060048969A1 Bus structure Public/Granted day:2006-03-09
Information query
