发明授权
- 专利标题： Power semiconductor apparatus provided with power controlling semiconductor modules connected in parallel to each other
- 专利标题（中）： 设置有彼此并联连接的功率控制半导体模块的功率半导体装置
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申请号： US11336991申请日： 2006-01-23
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公开(公告)号： US07619503B2公开(公告)日： 2009-11-17
- 发明人: Motonobu Joukou , Masanori Fukunaga , Nobutake Taniguchi , Takahiro Inoue , Nobuya Nishida
- 申请人： Motonobu Joukou , Masanori Fukunaga , Nobutake Taniguchi , Takahiro Inoue , Nobuya Nishida
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人： Mitsubishi Denki Kabushiki Kaisha
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2005-050781 20050225
- 主分类号： G05B23/02
- IPC分类号： G05B23/02
摘要：
A power semiconductor apparatus is provided with power controlling semiconductor modules connected in parallel to each other. Each power controlling semiconductor module controls driving of a power semiconductor device. The power semiconductor apparatus includes a transmission circuit and a reception circuit provided in one and another power controlling semiconductor modules, respectively. The transmission circuit transmits a predetermined communication signal to another power controlling semiconductor module based on a predetermined activation signal generated by one power controlling semiconductor module. The reception circuit receives the transmitted communication signal, and controls driving control operation of another power controlling semiconductor module based on the received communication signal.