发明授权
- 专利标题： Controllable heat transfer medium system and method for use with a circuit board
- 专利标题（中）： 可控传热介质系统和电路板使用方法
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申请号： US11841547申请日： 2007-08-20
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公开(公告)号： US07619889B2公开(公告)日： 2009-11-17
- 发明人: Zhihai Zack Yu , Jeong H. Kim , Tommy C. Lee
- 申请人： Zhihai Zack Yu , Jeong H. Kim , Tommy C. Lee
- 申请人地址： US CA Santa Clara
- 专利权人： NVIDIA Corporation
- 当前专利权人： NVIDIA Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Zilka-Kotab, PC
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A system and method are provided for controlling a transfer of heat between circuit board components. Included is a circuit board with components mounted thereon. Also provided is a controllable heat transfer medium for controlling a transfer of heat between the components.
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