发明授权
- 专利标题： Laser processing method
- 专利标题（中）： 激光加工方法
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申请号： US12363318申请日： 2009-01-30
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公开(公告)号： US07629229B2公开(公告)日： 2009-12-08
- 发明人: Hiroshi Morikazu
- 申请人： Hiroshi Morikazu
- 申请人地址： JP Tokyo
- 专利权人： Disco Corporation
- 当前专利权人： Disco Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Greer, Burns & Crain, Ltd.
- 优先权： JP2008-026737 20080206
- 主分类号： H01L21/46
- IPC分类号： H01L21/46
摘要：
In a laser beam processing method, when a laser beam is emitted along a second predetermined dividing line to form a second groove intersecting a first groove previously formed, the power output of the laser beam is allowed to be a first power output in a first interval, that is, until the second predetermined dividing line reaches a position immediately before the first groove. In a second interval from the position close to the first groove to the first groove reached by the second predetermined dividing line, the power output of the laser beam is set to a second power output lower than the first power output. Thus, overheat on the periphery of the second interval can be suppressed.
公开/授权文献
- US20090197351A1 LASER PROCESSING METHOD 公开/授权日：2009-08-06