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发明授权
US07629679B2 Semiconductor package, memory card including the same, and mold for fabricating the memory card 有权
半导体封装，包含相同的存储卡和用于制造存储卡的模具

  • 专利标题： Semiconductor package, memory card including the same, and mold for fabricating the memory card
  • 专利标题（中）： 半导体封装，包含相同的存储卡和用于制造存储卡的模具
  • 申请号： US11286314
    申请日： 2005-11-23
  • 公开(公告)号： US07629679B2
    公开(公告)日： 2009-12-08
  • 发明人: Hee-Jin Park
  • 申请人： Hee-Jin Park
  • 申请人地址： KR Suwon-si, Gyeonggi-do
  • 专利权人： Samsung Electronics Co., Ltd.
  • 当前专利权人： Samsung Electronics Co., Ltd.
  • 当前专利权人地址： KR Suwon-si, Gyeonggi-do
  • 代理机构： Volentine & Whitt, PLLC
  • 优先权： KR10-2004-0097596 20041125
  • 主分类号： H01L23/02
  • IPC分类号： H01L23/02
Semiconductor package, memory card including the same, and mold for fabricating the memory card
摘要：
A semiconductor package includes a printed circuit board, a semiconductor chip mounted on the printed circuit board, a wire structured to electrically connect the printed circuit board to the semiconductor chip, and an encapsulant that protects the semiconductor chip and the wire, the encapsulant disposed on the printed circuit board such that the encapsulant covers a surface of the printed in an edge region of the printed circuit board and exposes another surface of the printed circuit board in another edge region of the printed circuit board.
摘要（中）：

半导体封装包括印刷电路板，安装在印刷电路板上的半导体芯片，将印刷电路板电连接到半导体芯片的导线以及保护半导体芯片和导线的密封剂，密封剂设置在 印刷电路板，使得密封剂覆盖印刷电路板的边缘区域中的印刷表面，并将印刷电路板的另一个表面暴露在印刷电路板的另一个边缘区域中。

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