发明授权
- 专利标题： Wiring board, method of manufacturing wiring board, and liquid ejection head
- 专利标题（中）： 接线板，制造布线板的方法和液体喷射头
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申请号： US11520667申请日： 2006-09-14
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公开(公告)号： US07630207B2公开(公告)日： 2009-12-08
- 发明人: Toshiya Kojima
- 申请人： Toshiya Kojima
- 申请人地址： JP Tokyo
- 专利权人： Fujifilm Corporation
- 当前专利权人： Fujifilm Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2005-268560 20050915
- 主分类号： H05K7/00
- IPC分类号： H05K7/00
摘要：
The wiring board has electrical wires of a prescribed pattern. More specifically, the wiring board has a substrate on which grooves are formed in the prescribed pattern, each of the grooves having an undercut part; and a conductive material which is disposed inside the grooves so as to serve as the electrical wires.