发明授权
US07630208B2 Multilayer chip capacitor, circuit board apparatus having the capacitor, and circuit board
有权
多层片式电容器,具有电容器的电路板装置和电路板
- 专利标题: Multilayer chip capacitor, circuit board apparatus having the capacitor, and circuit board
- 专利标题(中): 多层片式电容器,具有电容器的电路板装置和电路板
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申请号: US12198342申请日: 2008-08-26
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公开(公告)号: US07630208B2公开(公告)日: 2009-12-08
- 发明人: Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
- 申请人: Byoung Hwa Lee , Sung Kwon Wi , Hae Suk Chung , Dong Seok Park , Sang Soo Park , Min Cheol Park
- 申请人地址: KR Gyunngi-Do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Gyunngi-Do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2007-0088544 20070831
- 主分类号: H05K1/16
- IPC分类号: H05K1/16
摘要:
Provided is a multilayer chip capacitor including a capacitor body having first and second capacitor units arranged in a lamination direction; and a plurality of external electrodes formed outside the capacitor body. The first capacitor unit includes at least one pair of first and second internal electrodes disposed alternately in an inner part of the capacitor body, the second capacitor unit includes a plurality of third and fourth internal electrodes disposed alternately in an inner part of the capacitor body, and the first to fourth internal electrodes are coupled to the first to fourth external electrodes. The first capacitor unit has a lower equivalent series inductance (ESL) than the second capacitor unit, and the first capacitor unit has a higher equivalent series resistance (ESR) than the second capacitor unit.