发明授权
- 专利标题: Enhanced multiple instrument distributed aperture sensor
- 专利标题(中): 增强多仪器分布式孔径传感器
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申请号: US11205012申请日: 2005-08-17
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公开(公告)号: US07631839B1公开(公告)日: 2009-12-15
- 发明人: Alan L. Duncan , Robert D. Sigler , David M. Stubbs , Eric H. Smith , Richard L. Kendrick , Joseph T. Pitman
- 申请人: Alan L. Duncan , Robert D. Sigler , David M. Stubbs , Eric H. Smith , Richard L. Kendrick , Joseph T. Pitman
- 申请人地址: US MD Bethesda
- 专利权人: Lockheed Martin Corporation
- 当前专利权人: Lockheed Martin Corporation
- 当前专利权人地址: US MD Bethesda
- 代理机构: McDermott Will & Emery LLP
- 主分类号: B64G1/00
- IPC分类号: B64G1/00
摘要:
A multiple instrument distributed aperture sensor (“MIDAS”) science payload system mounted on a spacecraft, including a spacecraft interface ring affixing the MIDAS science payload system to the spacecraft, and a multiple telescope array (“MTA”) further including a mechanical subsystem further including an optical bench, an optical subsystem mounted upon the mechanical subsystem collecting light and merging the light into a passive, actively-sensed or hyperspectral image, and a laser subsystem providing laser illumination for collecting active remote sensing data. The MIDAS science payload system also includes a hexapod in physical communication with and between the spacecraft interface ring and the mechanical subsystem. The MIDAS science payload system further includes a plurality of launch locks affixed to the spacecraft interface ring supporting the MTA in a stowed configuration, and a plurality of science instruments (“SIs”) mounted on the mechanical subsystem obverse to the optical subsystem, individually and concurrently sensing the passive, actively sensed or hyperspectral image.
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