发明授权
- 专利标题: Electronic device package and method of manufacturing the same
- 专利标题(中): 电子器件封装及其制造方法
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申请号: US11269613申请日: 2005-11-09
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公开(公告)号: US07632707B2公开(公告)日: 2009-12-15
- 发明人: Shou-Lung Chen , Ching-Wen Hsiao , Yu-Hua Chen , Jeng-Dar Ko , Jyh-Rong Lin
- 申请人: Shou-Lung Chen , Ching-Wen Hsiao , Yu-Hua Chen , Jeng-Dar Ko , Jyh-Rong Lin
- 申请人地址: TW Hsinchu
- 专利权人: Industrial Technology Research Institute
- 当前专利权人: Industrial Technology Research Institute
- 当前专利权人地址: TW Hsinchu
- 代理机构: Bacon & Thomas, PLLC
- 优先权: TW94100850A 20050112
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic device package with enhanced electrical performance and heat-dissipation efficiency are disclosed. The method comprises: providing a substrate having a plurality of vias and a plurality of electronic devices; forming a gluing layer on a surface of the substrate and fixing the electronic devices on the gluing layer, wherein the electronic devices have I/O units aligned with the vias respectively; forming a plurality of fixing layers in the gaps between the electronic devices; trenching a plurality of openings aligned with the vias respectively in the fixing layer; forming a plurality of metallic conductive units in the vias, the openings and part of the surface of the substrate; and forming a passivation layer over the other surface of the substrate.