发明授权
- 专利标题: Substrate holding device and polishing apparatus
- 专利标题(中): 基板保持装置和抛光装置
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申请号: US11791218申请日: 2005-12-06
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公开(公告)号: US07635292B2公开(公告)日: 2009-12-22
- 发明人: Tetsuji Togawa , Hiroshi Yoshida , Osamu Nabeya , Makoto Fukushima , Koichi Fukaya
- 申请人: Tetsuji Togawa , Hiroshi Yoshida , Osamu Nabeya , Makoto Fukushima , Koichi Fukaya
- 申请人地址: JP Tokyo
- 专利权人: Ebara Corporation
- 当前专利权人: Ebara Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Wenderoth, Lind & Ponack L.L.P.
- 优先权: JP2004-358859 20041210
- 国际申请: PCT/JP2005/022735 WO 20051206
- 国际公布: WO2006/062232 WO 20060615
- 主分类号: B24B29/00
- IPC分类号: B24B29/00
摘要:
A substrate holding device according to the present invention includes an elastic membrane to be brought into contact with a rear surface of a substrate, an attachment member for securing at least a portion of the elastic membrane, and a retainer ring for holding a peripheral portion of the substrate while in contact with the elastic membrane. The elastic membrane comprises at least one projecting portion, and the attachment member comprises at least one engagement portion engaging side surfaces of the at least one projecting portion of the elastic membrane. The elastic membrane further comprises bellows portions expandable in a pressing direction so as to allow the elastic membrane to press the substrate, and contractible along the pressing direction.
公开/授权文献
- US20070293129A1 Substrate Holding Device And Polishing Apparatus 公开/授权日:2007-12-20
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