发明授权
- 专利标题: Production system for wafer
- 专利标题(中): 晶圆生产系统
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申请号: US11327336申请日: 2006-01-09
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公开(公告)号: US07637708B2公开(公告)日: 2009-12-29
- 发明人: Toshihiko Aoki , Shunichi Imao , Akihiko Kosugi , Kiichi Uchino
- 申请人: Toshihiko Aoki , Shunichi Imao , Akihiko Kosugi , Kiichi Uchino
- 申请人地址: JP Tokyo
- 专利权人: Sumco Corporation
- 当前专利权人: Sumco Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Greenblum & Bernstein P.L.C.
- 主分类号: B65H1/00
- IPC分类号: B65H1/00
摘要:
The system includes a first conveying vehicle for holding and conveying wafers as products finished with an inspection step from a stock storage shelf group 11 to a reloading device 17, and a second conveying vehicle for holding and conveying a transporting container from a reloading device to a transporting storage shelf group: wherein a traveling course of the first conveying vehicle is provided on one side of the reloading device and a traveling course for the second conveying vehicle is provided on the other side; the reloading device includes a first mounting table for mounting the conveying container, a second mounting table for mounting the transporting container, and a reloading device for reloading wafers in the conveying container mounted on the first mounting table to the transporting container mounted on the second mounting table; and the installed number of the first mounting tables is larger than that of the second mounting tables.
公开/授权文献
- US20070157878A1 Production system for wafer 公开/授权日:2007-07-12
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