发明授权
US07638254B2 Positive photosensitive resin composition, method for forming pattern, and electronic part
有权
正型感光性树脂组合物，形成图案的方法和电子部件
- 专利标题： Positive photosensitive resin composition, method for forming pattern, and electronic part
- 专利标题（中）： 正型感光性树脂组合物，形成图案的方法和电子部件
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申请号： US12207958申请日： 2008-09-10
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公开(公告)号： US07638254B2公开(公告)日： 2009-12-29
- 发明人: Takashi Hattori , Yasuharu Murakami , Hiroshi Matsutani , Masayuki Ooe , Hajime Nakano
- 申请人： Takashi Hattori , Yasuharu Murakami , Hiroshi Matsutani , Masayuki Ooe , Hajime Nakano
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Dupont Microsystems Ltd
- 当前专利权人： Hitachi Chemical Dupont Microsystems Ltd
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2004-139149 20040507; JP2004-185613 20040623; JP2004-229285 20040805
- 主分类号： G03F7/023
- IPC分类号： G03F7/023
摘要：
Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.
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