Invention Grant
- Patent Title: Stress measuring method and instrument
- Patent Title (中): 应力测量方法和仪器
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Application No.: US10586148Application Date: 2004-03-05
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Publication No.: US07639348B2Publication Date: 2009-12-29
- Inventor: Yasushi Niitsu , Kensuke Ichinose , Kenji Gomi
- Applicant: Yasushi Niitsu , Kensuke Ichinose , Kenji Gomi
- Applicant Address: JP Tokyo
- Assignee: Tokyo Denki University
- Current Assignee: Tokyo Denki University
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2004-007599 20040115
- International Application: PCT/JP2004/002918 WO 20040305
- International Announcement: WO2005/068957 WO 20050728
- Main IPC: G01B11/16
- IPC: G01B11/16 ; G01J4/00

Abstract:
The stress of a sample semiconductor wafer is detected with high accuracy in the form of an absolute value without rotating the sample or the entire optical system. A laser light R is subjected to photoelastic modulation in a PEM 6 to generate a birefringence phase difference and then it is passed through first and second quarter wavelength plates and passes through a semiconductor wafer D having residual stress. When it is passed through a test piece, the direction of the stress of the test piece is detected when the angle between the laser light R and a linear polarization light is 0 and 90 degrees. The transmitted electric signal is delivered to an analog/digital converter 16, and the signal is inputted to a signal processor thus generating transmission signal data. The signal processor reads out the stored reference signal data and the transmission signal data and calculates a reference birefringence phase difference and the absolute values of the birefringence phase difference.
Public/Granted literature
- US20070273865A1 Stress Measuring Method And Instrument Public/Granted day:2007-11-29
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