Invention Grant
- Patent Title: Method for thermal seaming of polyimides
- Patent Title (中): 聚酰亚胺热接缝方法
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Application No.: US11740267Application Date: 2007-04-25
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Publication No.: US07641758B2Publication Date: 2010-01-05
- Inventor: Gregory Laue , William Clayton , Mark Johnson , Timothy Wright , Kevin Melton , Garrett Poe
- Applicant: Gregory Laue , William Clayton , Mark Johnson , Timothy Wright , Kevin Melton , Garrett Poe
- Applicant Address: US AL Huntsville
- Assignee: NeXolve Corp.
- Current Assignee: NeXolve Corp.
- Current Assignee Address: US AL Huntsville
- Agent David E. Mixon; Mark Swanson; Bradley Arant Boult Cumming
- Main IPC: G03G15/01
- IPC: G03G15/01
Abstract:
The present invention is a method for seaming a polyimide material. The method involves forming an interface between multiple the polyimide materials. Next, heat is applied to the interface to soften the polyimide material. The temperature of the heat source is below the melting point of the polyimide material. Finally, pressure is applied to the interface to create a seam between the polyimide materials.
Public/Granted literature
- US20080264561A1 Method for Thermal Seaming of Polyimides Public/Granted day:2008-10-30
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