Invention Grant
US07642133B2 Method of making a semiconductor package and method of making a semiconductor device
有权
制造半导体封装的方法和制造半导体器件的方法
- Patent Title: Method of making a semiconductor package and method of making a semiconductor device
- Patent Title (中): 制造半导体封装的方法和制造半导体器件的方法
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Application No.: US11828352Application Date: 2007-07-26
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Publication No.: US07642133B2Publication Date: 2010-01-05
- Inventor: Yen-Yi Wu , Wei-Yueh Sung , Pao-Huei Chang Chien , Chi-Chih Chu , Cheng-Yin Lee , Gwo-Liang Weng
- Applicant: Yen-Yi Wu , Wei-Yueh Sung , Pao-Huei Chang Chien , Chi-Chih Chu , Cheng-Yin Lee , Gwo-Liang Weng
- Applicant Address: TW
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW
- Agency: Cooley Godward Kronish LLP
- Priority: TW95135866A 20060927
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/44 ; H01L23/02
Abstract:
The present invention relates to a semiconductor package and a semiconductor device and a method of making the same. The method of making the semiconductor package comprises: providing a substrate; attaching a chip to a surface of the substrate; forming a plurality of connecting elements for electrically connecting the chip and the substrate; forming a plurality of first conductive bodies on the surface of the substrate; forming a molding compound for encapsulating the surface of the substrate, the chip, the connecting elements and the first conductive bodies; and removing a part of a border portion of the molding compound, so that the molding compound has two heights and one end of each first conductive bodies is exposed. Thereby, the molding compound covers the entire surface of the substrate, so that the bonding pads on the surface of the substrate will not be polluted.
Public/Granted literature
- US20080076208A1 Method of making a semiconductor package and method of making a semiconductor device Public/Granted day:2008-03-27
Information query
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