发明授权
- 专利标题： Electronic component assembly with composite material carrier
- 专利标题（中）： 电子元件组装与复合材料载体
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申请号： US12078672申请日： 2008-04-03
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公开(公告)号： US07642564B2公开(公告)日： 2010-01-05
- 发明人: Chia-Liang Hsu , Chien-Fu Huang
- 申请人： Chia-Liang Hsu , Chien-Fu Huang
- 申请人地址： TW Hsinchu
- 专利权人： Epistar Corporation
- 当前专利权人： Epistar Corporation
- 当前专利权人地址： TW Hsinchu
- 代理机构： Bacon & Thomas, PLLC
- 优先权： TW96112292A 20070404
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L21/00
摘要：
The present invention relates to an electronic component assembly including a composite material carrier, a circuit carrier made of a dielectric material, a circuit with a conductive material formed on the circuit carrier, an intermediate layer between the circuit carrier and the composite material carrier, and an electronic component arranged on the composite material carrier and electrically connecting to the circuit.
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