发明授权
- 专利标题: Systems and methods for aligning wafers or substrates
- 专利标题(中): 用于对准晶片或基板的系统和方法
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申请号: US10954201申请日: 2004-10-01
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公开(公告)号: US07642645B2公开(公告)日: 2010-01-05
- 发明人: Jurgen H. Daniel , Lars-Erik Swartz
- 申请人: Jurgen H. Daniel , Lars-Erik Swartz
- 申请人地址: US CT Norwalk
- 专利权人: Palo Alto Research Center Incorporated
- 当前专利权人: Palo Alto Research Center Incorporated
- 当前专利权人地址: US CT Norwalk
- 代理机构: Oliff & Berridge, PLC
- 主分类号: H01L23/34
- IPC分类号: H01L23/34
摘要:
Systems and methods for aligning substrates that include microstructures. The microstructures may be electronic or micromechanical components. The system includes a first substrate having a first alignment structure and a second substrate having a second alignment structure. The substrates are positioned so that the first alignment structure contacts the second alignment structure without the substrates directly contacting each other, and one of the substrates is adjusted in relation to the other substrate until the first and second alignment structures lock into place. After alignment, the microstructures on the first substrate and the second substrate may establish a connection with or be positioned in near proximity to each other.
公开/授权文献
- US20060070226A1 Systems and methods for aligning wafers or substrates 公开/授权日:2006-04-06