发明授权
US07642645B2 Systems and methods for aligning wafers or substrates 失效
用于对准晶片或基板的系统和方法

Systems and methods for aligning wafers or substrates
摘要:
Systems and methods for aligning substrates that include microstructures. The microstructures may be electronic or micromechanical components. The system includes a first substrate having a first alignment structure and a second substrate having a second alignment structure. The substrates are positioned so that the first alignment structure contacts the second alignment structure without the substrates directly contacting each other, and one of the substrates is adjusted in relation to the other substrate until the first and second alignment structures lock into place. After alignment, the microstructures on the first substrate and the second substrate may establish a connection with or be positioned in near proximity to each other.
公开/授权文献
信息查询
0/0