发明授权
US07642720B2 Addressable microplasma devices and arrays with buried electrodes in ceramic
有权
可寻址微型器件和阵列,其中埋置电极在陶瓷中
- 专利标题: Addressable microplasma devices and arrays with buried electrodes in ceramic
- 专利标题(中): 可寻址微型器件和阵列,其中埋置电极在陶瓷中
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申请号: US11337969申请日: 2006-01-23
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公开(公告)号: US07642720B2公开(公告)日: 2010-01-05
- 发明人: J. Gary Eden , Sung-Jin Park
- 申请人: J. Gary Eden , Sung-Jin Park
- 申请人地址: US IL Urbana
- 专利权人: The Board of Trustees of the University of Illinois
- 当前专利权人: The Board of Trustees of the University of Illinois
- 当前专利权人地址: US IL Urbana
- 代理机构: Greer, Burns & Crain, Ltd.
- 主分类号: H01J17/04
- IPC分类号: H01J17/04 ; H01J17/49
摘要:
An array of microcavity plasma devices is formed in a ceramic substrate that provides structure for and isolation of an array of microcavities that are defined in the ceramic substrate. The ceramic substrate isolates the microcavities from electrodes disposed within the ceramic substrate. The electrodes are disposed to ignite a discharge in microcavities in the array of microcavities upon application of a time-varying potential between the electrodes. Embodiments of the invention include electrode and microcavity arrangements that permit addressing of individual microcavities or groups of microcavities. The contour of the microcavity wall allows for the electric field within the microcavity to be shaped.
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