Invention Grant
US07642794B2 Method and system for compensating thermally induced motion of probe cards
有权
用于补偿探针卡热诱导运动的方法和系统
- Patent Title: Method and system for compensating thermally induced motion of probe cards
- Patent Title (中): 用于补偿探针卡热诱导运动的方法和系统
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Application No.: US11963575Application Date: 2007-12-21
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Publication No.: US07642794B2Publication Date: 2010-01-05
- Inventor: Benjamin N. Eldridge , Gary W. Grube , Ken S. Matsubayashi , Richard A. Larder , Makarand S. Shinde , Gaetan L. Mathieu
- Applicant: Benjamin N. Eldridge , Gary W. Grube , Ken S. Matsubayashi , Richard A. Larder , Makarand S. Shinde , Gaetan L. Mathieu
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agent N. Kenneth Burraston
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.
Public/Granted literature
- US20080094088A1 Method and System for Compensating Thermally Induced Motion of Probe Cards Public/Granted day:2008-04-24
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