Invention Grant
- Patent Title: Ethernet architecture with data packet encapsulation
- Patent Title (中): 具有数据包封装的以太网架构
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Application No.: US10394482Application Date: 2003-03-22
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Publication No.: US07643424B2Publication Date: 2010-01-05
- Inventor: Kuo-Hui Liu , Cheng-Hong Hu , Chin Yuan , Chou Lan Pok
- Applicant: Kuo-Hui Liu , Cheng-Hong Hu , Chin Yuan , Chou Lan Pok
- Applicant Address: US NV Reno
- Assignee: AT&T Intellectual Property l, L.P.
- Current Assignee: AT&T Intellectual Property l, L.P.
- Current Assignee Address: US NV Reno
- Agency: Toler Law Group
- Main IPC: H04J3/14
- IPC: H04J3/14

Abstract:
A method of encapsulating data packets for use in a distributed computer network is disclosed. The method includes providing a data packet for transmission over the distributed computer network, the data packet selected from one of a customer data packet and an OAM data packet; and encapsulating the data packet with a medium access control outer packet. The disclosed data packet handling method includes receiving a data packet from a customer facing data port, the customer facing data port within a network node of a computer network; performing medium access control (MAC) learning for the received packet; determining whether the data port is a MAC-in-MAC port; performing a packet mapping to a destination address based on a service provider destination address; and encapsulating the received data packet with a header associated with the service provider.
Public/Granted literature
- US20040184408A1 Ethernet architecture with data packet encapsulation Public/Granted day:2004-09-23
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