发明授权
- 专利标题: Vacuum pump and semiconductor manufacturing apparatus
- 专利标题(中): 真空泵和半导体制造装置
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申请号: US10887234申请日: 2004-07-09
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公开(公告)号: US07645126B2公开(公告)日: 2010-01-12
- 发明人: Shinichi Sekiguchi , Matsutaro Miyamoto
- 申请人: Shinichi Sekiguchi , Matsutaro Miyamoto
- 申请人地址: JP Tokyo
- 专利权人: Ebara Corporation
- 当前专利权人: Ebara Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Westerman, Hattori, Daniels & Adrian, LLP
- 优先权: JP2003-195407 20030710; JP2004-173085 20040610
- 主分类号: F04B17/00
- IPC分类号: F04B17/00 ; F01D5/14
摘要:
To provide a vacuum pump capable of evacuating in pressure ranges from an atmospheric pressure to a high vacuum, capable of rotating at a high speed to be downsized and improved in pumping performance, and capable of producing a completely oil-free vacuum.A vacuum pump for exhausting a gas comprises: a main shaft 5 rotatably supported by a bearing 22; a motor 23 for driving the main shaft 5 for rotation; a first exhaust section 10 having a first rotary vane 13 attached to the main shaft 5, a first fixed vane 14 fixed in a first casing 12, and an intake port 11; and a second exhaust section 30 having a second rotary vane 33 attached to the main shaft 5, a second fixed vane 34 fixed in a second casing 32, and an exhaust port 31. The intake port 11 is located in the vicinity of an end of the main shaft 5, and the first exhaust section 10, the bearing 22 and the second exhaust section 30 are arranged in this order axially along the main shaft 5.
公开/授权文献
- US20050025640A1 Vacuum pump and semiconductor manufacturing apparatus 公开/授权日:2005-02-03
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