- 专利标题: Semiconductor device and manufacturing method of the semiconductor device
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申请号: US11446393申请日: 2006-06-05
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公开(公告)号: US07645655B2公开(公告)日: 2010-01-12
- 发明人: Yukimune Watanabe , Shinji Migita , Nobuyuki Mise
- 申请人: Yukimune Watanabe , Shinji Migita , Nobuyuki Mise
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: Seiko Epson Corporation,Renesas Technology Corporation
- 当前专利权人: Seiko Epson Corporation,Renesas Technology Corporation
- 当前专利权人地址: JP Tokyo JP Tokyo
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2005-169631 20050609
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A semiconductor device includes a semiconductor layer formed on an insulating layer; a gate electrode disposed on said semiconductor layer via a gate insulating film; a source/drain layer composed by including an alloy layer or a metal layer with a bottom surface in contact with the insulating layer, with joint surfaces to a channel region disposed along crystal orientation faces of said semiconductor layer; and impurity-doped layers formed in a self-aligned manner along interfaces of the alloy layer or the metal layer, and said semiconductor layer.
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