Invention Grant
- Patent Title: Electrical interconnect with maximized electrical contact
- Patent Title (中): 电互连具有最大的电接触
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Application No.: US11298421Application Date: 2005-12-09
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Publication No.: US07645942B2Publication Date: 2010-01-12
- Inventor: Richard Schmachtenberg, III , John R. Andrews , Bradley J. Gerner , Jonathan R. Brick , Samuel Schultz , Chad J. Slenes
- Applicant: Richard Schmachtenberg, III , John R. Andrews , Bradley J. Gerner , Jonathan R. Brick , Samuel Schultz , Chad J. Slenes
- Applicant Address: US CT Norwalk
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Norwalk
- Agency: Marger Johnson & McCollom, P.C.
- Main IPC: H05K1/02
- IPC: H05K1/02
Abstract:
An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.
Public/Granted literature
- US20070131451A1 Electrical interconnect with maximized electrical contact Public/Granted day:2007-06-14
Information query
