发明授权
- 专利标题: Semiconductor device comprising buried wiring layer
- 专利标题(中): 包括掩埋布线层的半导体器件
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申请号: US11770337申请日: 2007-06-28
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公开(公告)号: US07646062B2公开(公告)日: 2010-01-12
- 发明人: Yoshikazu Yamaoka , Satoru Shimada
- 申请人: Yoshikazu Yamaoka , Satoru Shimada
- 申请人地址: JP Osaka
- 专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Ditthavong, Mori & Steiner, P.C.
- 优先权: JP2006-179119 20060629; JP2007-141961 20070529
- 主分类号: H01L27/01
- IPC分类号: H01L27/01 ; H01L27/12 ; H01L27/10 ; H01L29/73 ; H01L29/74 ; H01L27/148 ; H01L29/749 ; H01L29/768 ; H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要:
A semiconductor device that suppresses partial discharging to a semiconductor substrate caused by local concentration of current. The semiconductor device includes a semiconductor substrate, a gate electrode buried in the semiconductor substrate, a conductor buried in the semiconductor substrate further inward from the gate electrode, a wiring layer formed in the semiconductor substrate in connection with the conductor, and an insulation film arranged between the gate electrode and the conductor. The conductor is higher than the surface of the semiconductor substrate.
公开/授权文献
- US20080001214A1 SEMICONDUCTOR DEVICE 公开/授权日:2008-01-03
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