- 专利标题： Flip chip type LED lighting device manufacturing method
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申请号： US11798511申请日： 2007-05-15
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公开(公告)号： US07652298B2公开(公告)日： 2010-01-26
- 发明人: Jeffrey Chen , Chung Zen Lin
- 申请人： Jeffrey Chen , Chung Zen Lin
- 申请人地址： BN Begawan
- 专利权人： Neobulb Technologies, Inc.
- 当前专利权人： Neobulb Technologies, Inc.
- 当前专利权人地址： BN Begawan
- 代理机构： Rosenberg, Klein & Lee
- 优先权： TW93133779A 20041105
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.
公开/授权文献
- US20070257344A1 Flip chip type LED lighting device manufacturing method 公开/授权日：2007-11-08
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