Invention Grant
- Patent Title: Flip chip type LED lighting device manufacturing method
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Application No.: US11798511Application Date: 2007-05-15
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Publication No.: US07652298B2Publication Date: 2010-01-26
- Inventor: Jeffrey Chen , Chung Zen Lin
- Applicant: Jeffrey Chen , Chung Zen Lin
- Applicant Address: BN Begawan
- Assignee: Neobulb Technologies, Inc.
- Current Assignee: Neobulb Technologies, Inc.
- Current Assignee Address: BN Begawan
- Agency: Rosenberg, Klein & Lee
- Priority: TW93133779A 20041105
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.
Public/Granted literature
- US20070257344A1 Flip chip type LED lighting device manufacturing method Public/Granted day:2007-11-08
Information query
IPC分类:
