A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed duct portion and a removable duct portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the fixed and removable duct portions such that the block can be secured at least partially to each of the fixed duct portion and the removable duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.