A highly reliable covered multilayer module includes a plurality of side electrodes extending in a lamination direction of ceramic layers are provided at least at one of side surfaces of a multilayer module body. At least one of inner conductor layers is exposed at the side surface provided with the side electrodes, in a region interposed between an adjacently arranged pair of the side electrodes. A claw portion of a metal case is soldered to the side electrodes and the inner conductor layer. The plurality of inner conductor layers may be exposed at the side surface of the multilayer module body in the region interposed between the adjacently arranged pair of side electrodes such that at least a part of the inner conductor layer is superposed on the other inner conductor layer when seen in the lamination direction of the ceramic layers. The inner conductor layer may be exposed at the side surface of the multilayer module body such that the inner conductor layer extends from one to the other of the adjacently arranged pair of side electrodes.