A polishing apparatus comprising a base for affixing structures thereto, a drive wheel, a polishing wheel assembly, a polishing belt, and at least one routing wheel engaged with the polishing belt. The polishing wheel assembly includes an elongated arm including a distal end, and a rotatable polishing wheel supported at the distal end of the elongated arm. The polishing belt is made with an abrasive outer surface to perform the polishing, and an inner surface for engagement with the perimeters of the drive wheel and the polishing wheel. The routing wheel is engaged with the outer surface of the polishing belt, such that the contact arc of the polishing belt with the polishing wheel differs from an arc of the polishing wheel perimeter extending from a first tangent line between the drive wheel and the polishing wheel to a second tangent line between the drive wheel and the polishing wheel.