Invention Grant
- Patent Title: Plain bearing
- Patent Title (中): 平面轴承
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Application No.: US11730569Application Date: 2007-04-02
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Publication No.: US07662472B2Publication Date: 2010-02-16
- Inventor: Takuya Tanaka , Teruo Abe , Isei Naka , Yoshimi Kuroda , Tomomi Okumura
- Applicant: Takuya Tanaka , Teruo Abe , Isei Naka , Yoshimi Kuroda , Tomomi Okumura
- Applicant Address: JP Nagota
- Assignee: Daido Metal Co., Ltd.
- Current Assignee: Daido Metal Co., Ltd.
- Current Assignee Address: JP Nagota
- Agency: Browdy and Neimark, PLLC
- Priority: JP2006-096174 20060331
- Main IPC: B32B15/08
- IPC: B32B15/08 ; F16C33/02

Abstract:
An object of the present invention is to provide a plain bearing which can be further improved in bearing capability, in particular, anti-seizure property, initial conformability and cavitation resistance. In the present invention, a sliding layer 2 is formed on the surface of a bearing alloy layer 1 formed of a copper-based or aluminum-based alloy, and the sliding layer 2 comprises a resin binder obtained by applying a strong shearing force to a composition comprising a polybenzimidazole resin as main constituent and at least one member selected from the group consisting of a polyamide-imide resin, a polyamide resin and an epoxy resin, to make the composition into a polymer alloy, and 25 to 75 mass % of a solid lubricant. Owing to such a constitution, toughness and strength are imparted to the sliding layer 2 and the anti-seizure property, initial conformability and cavitation resistance can also be improved.
Public/Granted literature
- US20070230846A1 Plain bearing Public/Granted day:2007-10-04
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