Invention Grant
- Patent Title: Integrated circuit inspection system
- Patent Title (中): 集成电路检测系统
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Application No.: US11216541Application Date: 2005-08-31
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Publication No.: US07662648B2Publication Date: 2010-02-16
- Inventor: Gurtej S. Sandhu , Neal R. Rueger
- Applicant: Gurtej S. Sandhu , Neal R. Rueger
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
Methods and systems that include a nanotube used as an emitter in the testing and fabrication of integrated circuits. The nanotube emits a signal to a substrate. Based on the signal or the electrical properties, e.g., current induced in the substrate by the signal, the region of the substrate is characterized. The characterization includes topology of the region of the substrate such as determining whether a recess in the substrate has a proper depth or other dimensions or characteristics of the substrate.
Public/Granted literature
- US20070046172A1 Integrated circuit inspection system Public/Granted day:2007-03-01
Information query
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