发明授权
- 专利标题: Circuit board with improved ground plane
- 专利标题(中): 电路板具有改进的接地平面
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申请号: US11737147申请日: 2007-04-19
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公开(公告)号: US07663063B2公开(公告)日: 2010-02-16
- 发明人: Yu-Hsu Lin , Jeng-Da Wu , Chih-Hang Chao
- 申请人: Yu-Hsu Lin , Jeng-Da Wu , Chih-Hang Chao
- 申请人地址: TW Tu-Cheng, Taipei Hsien
- 专利权人: Hon Hai Precision Industry Co., Ltd.
- 当前专利权人: Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址: TW Tu-Cheng, Taipei Hsien
- 代理商 Frank R. Niranjan
- 优先权: CN200610157882 20061222
- 主分类号: H05K1/03
- IPC分类号: H05K1/03
摘要:
A circuit board is provided for improving signal quality, including a signal plane for a plurality of signal traces arranged thereon and a ground plane formed by a plurality of tiles connected to each other in an array. Each tile is formed by ground traces. Different line segments of a signal trace mapped on the ground plane cross ground traces of the tiles at similar angles, thereby minimizing interaction between the ground traces and the signal traces to reduce differences in impedances of the signal traces.
公开/授权文献
- US20080151521A1 CIRCUIT BOARD WITH IMPROVED GROUND PLANE 公开/授权日:2008-06-26
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