Invention Grant
- Patent Title: Luminescent diode chip that is flip-chip mounted on a carrier, and method for production thereof
- Patent Title (中): 背面安装在载体上的发光二极管芯片及其制造方法
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Application No.: US11184239Application Date: 2005-07-18
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Publication No.: US07663155B2Publication Date: 2010-02-16
- Inventor: Volker Harle , Dominik Eisert
- Applicant: Volker Harle , Dominik Eisert
- Applicant Address: DE Regensburg
- Assignee: Osram Opto Semiconductors GmbH
- Current Assignee: Osram Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Cohen Pontani Lieberman & Pavane LLP
- Priority: DE10214210 20020328
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A luminescent diode chip for flip-chip mounting on a carrier, having a conductive substrate (12), a semiconductor body (14) that contains a photon-emitting active zone and that is joined by an underside to the substrate (12), and a contact (18), disposed on a top side of the semiconductor body (14), for making an electrically conductive connection with the carrier (30) upon the flip-chip mounting of the chip, whereby either the carrier is solder covered or a layer of solder is applied to the contact. An insulating means (40, 42, 44, 46, 48) is provided on the chip, for electrically insulating free faces of the semiconductor body (14) and free surfaces of the substrate (12) from the solder.
Public/Granted literature
- US20050248032A1 Luminescent diode chip that is flip-chip mounted on a carrier, and method for production thereof Public/Granted day:2005-11-10
Information query
IPC分类:
