发明授权
- 专利标题： Luminescent diode chip that is flip-chip mounted on a carrier, and method for production thereof
- 专利标题（中）： 背面安装在载体上的发光二极管芯片及其制造方法
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申请号： US11184239申请日： 2005-07-18
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公开(公告)号： US07663155B2公开(公告)日： 2010-02-16
- 发明人: Volker Harle , Dominik Eisert
- 申请人： Volker Harle , Dominik Eisert
- 申请人地址： DE Regensburg
- 专利权人： Osram Opto Semiconductors GmbH
- 当前专利权人： Osram Opto Semiconductors GmbH
- 当前专利权人地址： DE Regensburg
- 代理机构： Cohen Pontani Lieberman & Pavane LLP
- 优先权： DE10214210 20020328
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A luminescent diode chip for flip-chip mounting on a carrier, having a conductive substrate (12), a semiconductor body (14) that contains a photon-emitting active zone and that is joined by an underside to the substrate (12), and a contact (18), disposed on a top side of the semiconductor body (14), for making an electrically conductive connection with the carrier (30) upon the flip-chip mounting of the chip, whereby either the carrier is solder covered or a layer of solder is applied to the contact. An insulating means (40, 42, 44, 46, 48) is provided on the chip, for electrically insulating free faces of the semiconductor body (14) and free surfaces of the substrate (12) from the solder.
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