发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US11407323申请日: 2006-04-20
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公开(公告)号: US07663207B2公开(公告)日: 2010-02-16
- 发明人: Kuniko Kikuta , Masayuki Furumiya , Ryota Yamamoto , Makoto Nakayama
- 申请人: Kuniko Kikuta , Masayuki Furumiya , Ryota Yamamoto , Makoto Nakayama
- 申请人地址: JP Kanagawa
- 专利权人: NEC Electronics Corporation
- 当前专利权人: NEC Electronics Corporation
- 当前专利权人地址: JP Kanagawa
- 代理机构: Young & Thompson
- 优先权: JP2005-123462 20050421
- 主分类号: H01L29/00
- IPC分类号: H01L29/00
摘要:
A semiconductor device includes a capacitor with an MIM structure, by which the dimensional accuracy of the device is improved, and a stable capacitance value is given. The semiconductor device 100 includes: a semiconductor substrate 102; a capacitor forming region 130 in which an MIM capacitor is formed, which has an insulating interlayer 104 formed on the semiconductor substrate 102, a first electrode 110, and a second electrode 112, and the first electrode 110 and the second electrode 112 are arranged facing each other through the insulating interlayer 104; and a shielding region 132 which includes a plurality of shielding electrodes 114 formed in the outer edge of the capacitor forming region 130 and, at the same time, set at a predetermined potential in the same layer as that of the MIM capacitor on the semiconductor substrate 102, and shields the capacitor forming region 130 from other regions.
公开/授权文献
- US20060237819A1 Semiconductor device 公开/授权日:2006-10-26
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