A punch type substrate strip includes a plurality of substrate units, a plurality of slots and at least one plating-trace collecting hole. The slots are formed around the substrate units. The plating-trace collecting hole is located outside the substrate units. The substrate strip is provided with a plurality of connecting pads, a plurality of first plating traces and at least one second plating trace. The connecting pads are disposed in each substrate unit, and the first plating traces and the second plating trace are electrically connected to the connecting pads. The first plating traces have a plurality of first broken ends located in the slots. The second plating trace is extended across a region located between the slots, and has a second broken end located in the plating-trace collecting hole. Accordingly, more extensive space for plating traces can be provided.