Invention Grant
- Patent Title: Integrated circuit component with a surface-mount housing
- Patent Title (中): 具有表面贴装外壳的集成电路元件
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Application No.: US11839740Application Date: 2007-08-16
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Publication No.: US07663218B2Publication Date: 2010-02-16
- Inventor: Michael Bauer , Edward Fuergut , Simon Jerebic , Hermann Vilsmeier
- Applicant: Michael Bauer , Edward Fuergut , Simon Jerebic , Hermann Vilsmeier
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE102005007486 20050217
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor component including a surface-mount housing and a method for producing the same are described herein. The semiconductor component includes lead pieces embedded into a plastic housing composition and arranged on an underside of the housing. External contact areas of the lead pieces are free of the plastic housing composition. A structured solderable coating is arranged on the external contact areas that have been kept free of the plastic housing composition, the coating includes a plurality of electrically conductive and mechanically elastic contact elements.
Public/Granted literature
- US20080029874A1 Integrated Circuit Component with a Surface-Mount Housing and Method for Producing the Same Public/Granted day:2008-02-07
Information query
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