Invention Grant
US07663728B2 Systems for providing conducting pad and fabrication method thereof
有权
用于提供导电垫的系统及其制造方法
- Patent Title: Systems for providing conducting pad and fabrication method thereof
- Patent Title (中): 用于提供导电垫的系统及其制造方法
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Application No.: US11390743Application Date: 2006-03-28
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Publication No.: US07663728B2Publication Date: 2010-02-16
- Inventor: Hong-Pin Ko , Chien-Chih Chen , Chia-Cheng Lin , Wen-Chieh Teng , Ping Luo
- Applicant: Hong-Pin Ko , Chien-Chih Chen , Chia-Cheng Lin , Wen-Chieh Teng , Ping Luo
- Applicant Address: TW
- Assignee: TPO Displays Corp.
- Current Assignee: TPO Displays Corp.
- Current Assignee Address: TW
- Agency: Thomas, Kayden, Horstemeyer & Risley, LLP.
- Main IPC: G02F1/1345
- IPC: G02F1/1345 ; G02F1/136
Abstract:
A system for providing conducting pads of a display panel has a base layer on a substrate, a first insulator on the base layer having a plurality of grooves, a second conductive layer inside the grooves, and a patterned third conductive layer covering the second conductive layer. The first insulator serves as a barricade for fixing the second conductive layer in the grooves.
Public/Granted literature
- US20070229751A1 Systems for providing conducting pad and fabrication method thereof Public/Granted day:2007-10-04
Information query
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