发明授权
- 专利标题： Heat transfer mechanism, heat dissipation system, and communication apparatus
- 专利标题（中）： 传热机构，散热系统和通讯设备
-
申请号： US10871675申请日： 2004-06-18
-
公开(公告)号： US07663883B2公开(公告)日： 2010-02-16
- 发明人: Takashi Shirakami , Naoya Yamazaki , Kazuhiro Iino , Yoshiaki Tada , Satoshi Ueda
- 申请人： Takashi Shirakami , Naoya Yamazaki , Kazuhiro Iino , Yoshiaki Tada , Satoshi Ueda
- 申请人地址： JP Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JP Kawasaki
- 代理机构： Katten Muchin Rosenman LLP
- 优先权： JP2004-036815 20040213
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heat transfer mechanism for dissipating heat from a heat generating body to a heat dissipating part, realizing both a high elasticity and a high thermal conductivity, comprised of a film-shaped heat conductor for transferring heat to the heat dissipating part and an elastic member for imparting elasticity to the film-shaped heat conductor, the film-shaped heat conductor being formed from metal foil-type flexible heat pipes or carbon-based thermal conductive sheets.