Invention Grant
- Patent Title: Mechanism for facilitating hot swap capability
- Patent Title (中): 促进热插拔能力的机制
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Application No.: US11585407Application Date: 2006-10-23
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Publication No.: US07663889B2Publication Date: 2010-02-16
- Inventor: Robert J. Lajara , Kenneth Kitlas , Bakul V. Herekar
- Applicant: Robert J. Lajara , Kenneth Kitlas , Bakul V. Herekar
- Applicant Address: US CA Santa Clara
- Assignee: Sun Microsystems, Inc.
- Current Assignee: Sun Microsystems, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Osha • Liang LLP
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
An assembly is disclosed which enables a printed circuit board (PCB) to be added to or removed from a computer system without deactivating other parts of the system. The assembly, which holds the PCB, translates lateral motion into vertical motion to enable lateral motion to be applied to derive the vertical motion needed to plug and unplug a PCB into and out of an expansion slot. This motion translation makes it possible to insert or remove a PCB via a rear, front, or side access portal of a housing rather than through the top of the housing. Thus, the assembly eliminates the need to remove the housing from a rack, or to remove a top from the housing, which in turn eliminates the need to shut down any other parts of the system. Thus, the assembly enables a PCB to be “hot swapped” into and out of a computer system.
Public/Granted literature
- US20080094810A1 Mechanism for facilitating hot swap capability Public/Granted day:2008-04-24
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