发明授权
- 专利标题： Component mounting board structure and production method thereof
- 专利标题（中）： 组件安装板结构及其制造方法
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申请号： US11431097申请日： 2006-05-10
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公开(公告)号： US07663891B2公开(公告)日： 2010-02-16
- 发明人: Hirokazu Tanaka , Hiroyuki Ishibashi
- 申请人： Hirokazu Tanaka , Hiroyuki Ishibashi
- 申请人地址： JP Kyoto-Shi
- 专利权人： Omron Corporation
- 当前专利权人： Omron Corporation
- 当前专利权人地址： JP Kyoto-Shi
- 代理机构： Foley & Lardner LLP
- 优先权： JPP2005-141748 20050513; JPP2006-118733 20060424
- 主分类号： H05K7/00
- IPC分类号： H05K7/00
摘要：
In a lead frame board, while a heat radiation wall member formed by a resin having a relatively high thermal conductivity is provided in a low heat-resistance heat generating component mounting region where a low heat-resistance heat generating component is mounted, heat block wall members formed by resins having relatively low thermal conductivities are provided in a high heat-resistance heat generating component mounting region where a high heat-resistance heat generating component is mounted and in a non-heat generating component mounting region where a non-heat generating component is mounted. Thus, heat block is performed between the low heat-resistance heat generating component mounting region and the high heat-resistance heat generating component mounting region and non-heat generating component mounting region, and a heat radiation function is enhanced in the low heat-resistance heat generating component.