发明授权
- 专利标题： Method of manufacturing printed circuit board using imprinting process
- 专利标题（中）： 使用压印工艺制造印刷电路板的方法
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申请号： US11334240申请日： 2006-01-17
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公开(公告)号： US07666292B2公开(公告)日： 2010-02-23
- 发明人: Jae Choon Cho , Il Sang Maeng , Choon Keun Lee , Seung Hyun Ra
- 申请人： Jae Choon Cho , Il Sang Maeng , Choon Keun Lee , Seung Hyun Ra
- 申请人地址： KR Gyeonggi-Do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-Do
- 代理机构： Darby & Darby P.C.
- 优先权： KR10-2005-0032701 20050420
- 主分类号： C25D5/02
- IPC分类号： C25D5/02
摘要：
The present invention relates to a method of manufacturing a printed circuit board using an imprinting process, in which a pattern having a large area can be uniformly formed using a plurality of molds, and the plurality of molds is sequentially removed, thereby solving problems occurring in release of the molds from an insulating layer.
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