Invention Grant
- Patent Title: Sealing material and method of applying the same
- Patent Title (中): 密封材料及其应用方法
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Application No.: US10547334Application Date: 2004-04-13
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Publication No.: US07666472B2Publication Date: 2010-02-23
- Inventor: Katsumi Hirose
- Applicant: Katsumi Hirose
- Applicant Address: JP Tokyo
- Assignee: The Yokohama Rubber Co., Ltd.
- Current Assignee: The Yokohama Rubber Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JP2003-108979 20030414
- International Application: PCT/JP2004/005243 WO 20040413
- International Announcement: WO2004/092296 WO 20041028
- Main IPC: C05D7/22
- IPC: C05D7/22

Abstract:
Disclosed is a sealing material formed of a powdered material into which a rubber base sealing material with a viscosity of 20 to 200 Pa·s/100° C. is pulverized at a temperature lower than, or equal to, a brittle temperature of the rubber base sealing material, and a method of applying the sealing material, which includes applying the powdered material to a surface to be coated with the powdered material, by a spray coating process.
Public/Granted literature
- US20060148927A1 Sealer and method for its application Public/Granted day:2006-07-06
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