发明授权
- 专利标题: Fabrication method of semiconductor package
- 专利标题(中): 半导体封装的制造方法
-
申请号: US12367723申请日: 2009-02-09
-
公开(公告)号: US07666716B2公开(公告)日: 2010-02-23
- 发明人: Han-Ping Pu , Cheng-Hsu Hsiao
- 申请人: Han-Ping Pu , Cheng-Hsu Hsiao
- 申请人地址: TW Taichung
- 专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人: Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址: TW Taichung
- 代理机构: Edwards Angell Palmer & Dodge LLP
- 代理商 Peter F. Corless; Steven M. Jensen
- 优先权: TW95125203A 20060711
- 主分类号: H01L21/44
- IPC分类号: H01L21/44 ; H01L21/48
摘要:
The present invention provides a semiconductor package and a fabrication method thereof. The method includes the steps of: providing a chip carrier module having a plurality of chip carriers, disposing a plurality of electrical connecting points on the chip carriers, performing chip mounting and molding on the chip carrier module to form an encapsulant encapsulating the semiconductor chip, exposing the electrical connecting points from the encapsulant; forming a patterned circuit layer on the encapsulant, electrically connecting the patterned circuit layer to the electrical connecting points, cutting and separating the chip carriers to form a plurality of semiconductor packages each having a circuit layer formed on the encapsulant such that the circuit layer provides extra electrical connecting points and thereby enhances electrical performance of electrical products. During a package stacking process, no package is limited by the design of another package below.
公开/授权文献
- US20090146285A1 FABRICATION METHOD OF SEMICONDUCTOR PACKAGE 公开/授权日:2009-06-11