Invention Grant
- Patent Title: Multilayer-structured bolometer and method of fabricating the same
- Patent Title (中): 多层结构测辐射热计及其制造方法
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Application No.: US12182456Application Date: 2008-07-30
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Publication No.: US07667202B2Publication Date: 2010-02-23
- Inventor: Sang Hoon Cheon , Ho Jun Ryu , Woo Seok Yang , Seong Mok Cho , Byoung Gon Yu , Chang Auck Choi
- Applicant: Sang Hoon Cheon , Ho Jun Ryu , Woo Seok Yang , Seong Mok Cho , Byoung Gon Yu , Chang Auck Choi
- Applicant Address: KR Daejeon
- Assignee: Electronics & Telecommunications Research Institute
- Current Assignee: Electronics & Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2007-0133497 20071218
- Main IPC: G01J5/20
- IPC: G01J5/20

Abstract:
Provided are a multilayer-structured bolometer and a method of fabricating the same. In the multilayer-structured bolometer, the number of support arms supporting the body of a sensor structure is reduced to one, and two electrodes are formed on the one support arm. Thus, the sensor structure is electrically connected with a substrate through the only one support arm. According to the multilayer-structured bolometer and method of fabricating the bolometer, the thermal conductivity of the sensor structure is considerably reduced to remarkably improve sensitivity to temperature, and also the pixel size of the bolometer is reduced to obtain high-resolution thermal images. In addition, the multilayer-structured bolometer can have a high fill-factor due to a sufficiently large infrared-absorbing layer, and thus can improve infrared absorbance.
Public/Granted literature
- US20090152467A1 MULTILAYER-STRUCTURED BOLOMETER AND METHOD OF FABRICATING THE SAME Public/Granted day:2009-06-18
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