Invention Grant
- Patent Title: Flip-chip package having thermal expansion posts
- Patent Title (中): 具有热膨胀柱的倒装芯片封装
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Application No.: US11238419Application Date: 2005-09-28
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Publication No.: US07667473B1Publication Date: 2010-02-23
- Inventor: Robert O. Conn , Steven J. Carey
- Applicant: Robert O. Conn , Steven J. Carey
- Applicant Address: US CA San Jose
- Assignee: XILINX, Inc
- Current Assignee: XILINX, Inc
- Current Assignee Address: US CA San Jose
- Agent William L. Paradice, III; John J. King
- Main IPC: G01R31/02
- IPC: G01R31/02
Abstract:
A semiconductor package having a substrate and a die includes a plurality of conductive posts attached to the substrate and bonded to an active surface of the die via a plurality of corresponding microbumps. The conductive posts are flexible and extend beyond the top surface of the substrate a sufficient distance to absorb lateral forces exerted upon the microbumps.
Information query
