Invention Grant
- Patent Title: Stress component measurement method
- Patent Title (中): 应力分量测量方法
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Application No.: US11869224Application Date: 2007-10-09
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Publication No.: US07668668B2Publication Date: 2010-02-23
- Inventor: Nobuyuki Naka , Shinsuke Kashiwagi
- Applicant: Nobuyuki Naka , Shinsuke Kashiwagi
- Applicant Address: JP Kyoto
- Assignee: Horiba, Ltd.
- Current Assignee: Horiba, Ltd.
- Current Assignee Address: JP Kyoto
- Priority: JPP2006-277028 20061010; JPP2007-171149 20070628
- Main IPC: G01L5/00
- IPC: G01L5/00

Abstract:
A method of measuring a stress component in a short period of time in a nondestructive manner and a stress component measurement device that includes a stress component comparison section that compares a Raman spectrum L obtained in a predetermined area W1 of a reference specimen W to which a given stress component is applied with the stress component, a correlation data production section that produces correlation data indicating a correlation between the Raman spectrum L and the stress component by the use of a multivariate analysis method based on the comparison results conducted by the stress component comparison section. The comparison is conducted multiple times on different predetermined areas W1. A correlation data storage section stores the correlation data, and a stress component calculation section calculates a stress component applied to a measurement area W1′ of a measurement specimen W′ whose composition is the same as that of the reference specimen W based on the Raman spectrum L obtained from the measurement area W1′ and the correlation data.
Public/Granted literature
- US20080086276A1 STRESS COMPONENT MEASUREMENT METHOD Public/Granted day:2008-04-10
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