发明授权
- 专利标题： IC tiling pattern method, IC so formed and analysis method
- 专利标题（中）： IC贴片图案法，IC形成及分析方法
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申请号： US11160339申请日： 2005-06-20
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公开(公告)号： US07669159B2公开(公告)日： 2010-02-23
- 发明人: Robert J. Allen , John M. Cohn , Peter A. Habitz , William Leipold , Ivan Wemple , Paul S. Zuchowski
- 申请人： Robert J. Allen , John M. Cohn , Peter A. Habitz , William Leipold , Ivan Wemple , Paul S. Zuchowski
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Ira D. Blecker
- 主分类号： G06F17/50
- IPC分类号： G06F17/50
摘要：
The invention provides a method for providing an integrated circuit (6) having a substantially uniform density between parts (10, 12, 14 and 16) of the IC that are non-orthogonally angled. In particular, the invention provides fill tiling patterns (32, 34) oriented substantially parallel to electrical structure regardless of their angle. A method of electrical analysis based on this provision is also provided as is a related program product.
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